EPEPS

Electrical Performance of Electronic Packaging and Systems

TECHNICAL PROGRAM COMMITTEE

18th Annual Topical Meeting on Electrical Performance of Electronic Packaging and Systems

Meeting Co-Chairs

1. Andreas Weisshaar, Oregon State University & National Science Foundation
2. Dale Becker, IBM

Members

1. Ram Achar, Carlton University
2. Henning Braunisch, Intel
3. Flavio Canavero, Politecnico di Torino
4. Moises Cases, IBM (rtd)
5. Paul Franzon, North Carolina State University
6. Helmut Grabinski, University of Hannover
7. Vikram Jandhyala, University of Washington
8. Michael Lamson, Texas Instruments (rtd)
9. Kathleen Melde, University of Arizona
10. Michel Nakhla, Carlton University
11. Christopher Pan, Qualcomm
12. Albert Ruehli, IBM (rtd)
13. Jose Schutt-Aine, University of Illinois
14. Brian Young, Texas Instruments
15. Chuck Yuan, Rambus
16. Thomas-Michael Winkel, IBM