EPEPS 2012: San Jose, California
IEEE

Conference Sponsors

Ansys

Gold Sponsors

Cadence

Rambus

Silver Sponsors

Nimbic

ASE Group

3DIC-RC

Idemworks

Conference Sponsors

CST

Simberian Inc.

Society Sponsors

IEEE Components, Packaging & Manufacturing Technology Society

The IEEE Microwave Theory and Techniques Society

 

CONFERENCE Committees

Conference Co-chairs:

Vikram Jandhyala, University of Washington vj@uw.edu
Kathleen L. Melde, University of Arizona melde@ece.arizona.edu

Technical Program Committee (TPC):

Peter H. Aaen, Freescale Semiconducors
Ramachandra Achar, Carleton University
Dale Becker, IBM
Henning Braunisch, Intel
Flavio Canavero, Politecnico di Torino
Paul Franzon, North Carolina State University
Hartmut Grabinski, University of Hannover
Kevin Gu, IBM
Vikram Jandhyala, University of Washington
Joungho Kim, KAIST
Michael Lamson, Texas Instruments (rtd)
Kathleen Melde, University of Arizona
Michel Nakhla, Carleton University
Dan Oh, Altera
Albert Ruehli, Emeritus IBM; Missouri University Science & Technology
Jose Schutt-Aine, University of Illinois
Andreas Weisshaar, Oregon State University
Thomas-Michael Winkel, IBM
Brian Young, Freescale Semiconductor