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EPEPS
Electrical Performance of Electronic Packaging and Systems
TECHNICAL PROGRAM COMMITTEE
18th Annual Topical Meeting on Electrical Performance of Electronic Packaging
and Systems
Meeting Co-Chairs
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Andreas Weisshaar, Oregon State University & National Science Foundation
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Dale Becker, IBM
Members
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Ram Achar, Carlton University
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Henning Braunisch, Intel
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Flavio Canavero, Politecnico di Torino
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Moises Cases, IBM (rtd)
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Paul Franzon, North Carolina State University
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Helmut Grabinski, University of Hannover
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Vikram Jandhyala, University of Washington
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Michael Lamson, Texas Instruments (rtd)
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Kathleen Melde, University of Arizona
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Michel Nakhla, Carlton University
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Christopher Pan, Qualcomm
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Albert Ruehli, IBM (rtd)
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Jose Schutt-Aine, University of Illinois
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Brian Young, Texas Instruments
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Chuck Yuan, Rambus
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Thomas-Michael Winkel, IBM
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