IEEE Components, Packaging & Manufacturing Technology Society
EPEPS is
the premier international conference on advanced and emerging issues in electrical
modeling, analysis and design of electronic interconnections, packages and systems.
It also focuses on new methodologies and design techniques for evaluating and
ensuring signal, power and thermal integrity in high-speed designs. EPEPS is
jointly sponsored by the IEEE Components, Packaging and Manufacturing Technology
Society and IEEE Microwave Theory and Techniques Society.
Registration & Hotel Accomodation
Early Bird Registration will open August 1, 2013.
Hotel accomodations can be made in July.
Tutorials/Workshops
Check back soon for more information.