EPEPS

Electrical Performance of Electronic Packaging and Systems

Submission Deadline extended: July 28, 2009

18th Conference on Electrical Performance of Electronic Packaging and Systems

EPEP 2009

Call for Papers

The general subject of the conference is the electrical design, analysis, modeling and measurement of interconnections and packaging structures of electronic systems. The goal of the conference is to be the leading forum for exchange of ideas on advanced and emerging topics on the electrical design of systems to assure electrical performance; especially signal integrity and power integrity. 

Authors are invited to submit papers describing new technical contributions in the areas broadly covered below:

• Current and future issues related to signal interconnections including on-chip and system interconnect structures.
• Signal integrity of interconnections.
• Power integrity of electronic components and systems.
• Design and measurement of high speed links, including jitter and noise management and characterization.
• Innovative interconnect packaging structures and their electrical performance.
• Measurement and data analysis techniques for system level and on-chip structures.
• Signal and power integrity in mixed signal and RF circuits and modules.
• RF/microwave packaging structures and their electrical performance.
• Electromagnetic modeling and simulation algorithms, tools and design flows.
• Macromodeling and model reduction as it applies to electrical analysis.
• Advances in transmission-line analysis techniques.

Conference Co-chairs:   Andreas Weisshaar, Oregon State University & National Science Foundation and Dale Becker, IBM.

Conference Web Page: Detailed information can be found at http://www.epeps.org

Paper Submission: Electronic submissions of no more than four pages must be received no later than July 18, 2009.  Papers should be compliant with the general standards of the IEEE, including inclusion of appropriate references.

Student Paper Award: Two student best paper awards may be presented. The paper submission must include a letter from the student’s advisor to be eligible.

Short Courses/Workshops: On Sunday, October 18, 2009 a workshop entitled "Future Directions in IC and Package Design (FDIP)" will be presented and short courses/tutorials may be offered.

For more information please see the web site at:   http://www.epeps.org

or contact:  Andreas Weisshaar, email:  andreas@eecs.oregonstate.edu
Kelly Sutton, email: epd@email.arizona.edu