IEEE Components, Packaging & Manufacturing Technology Society
EPEPS is
the premier international conference on advanced and emerging issues in electrical
modeling, analysis and design of electronic interconnections, packages and systems.
It also focuses on new methodologies and design techniques for evaluating and
ensuring signal, power and thermal integrity in high-speed designs. EPEPS is
jointly sponsored by the IEEE Components, Packaging and Manufacturing Technology
Society and IEEE Microwave Theory and Techniques Society.
Registration & Hotel Accomodation
For on-line registration, click here
The participants are encouraged to take advantage of the Early Bird Discounts. Early Bird Registration is open until September 30, 2011.
The Doubletree Hotel in San Jose is holding a block of rooms at the special rate of $140.00 plus tax, single or double occupancy for conference attendees. Room reservations must
be made by September 30, 2011 to
guarantee this rate. Individuals must identify as an attendee of EPEPS conference, follow this link, or use code "UAE" online to avail the discounted rate.
Tutorials/Workshops
This year's conference offers free tutorials on state-of-the-art topics during the conference. On Sunday, a half-day tutorial on "S-Parameters to X-Parameters: From Concept to Practice with Linear & Nonlinear Systems for Signal Integrity Design, Modeling, Simulation & Measurements" will be presented by Mike Resso & David Root of Agilent Technologies . For more details, please click here...
Exhibits: Conference offers an excellent array of vendor exhibits. EPEPS is an exciting forum for vendors to demonstrate.