EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems. It also focuses on new methodologies and design techniques for evaluating and ensuring signal, power and thermal integrity in high-speed designs. EPEPS is jointly sponsored by the IEEE Components, Packaging and Manufacturing Technology Society and IEEE Microwave Theory and Techniques Society.
Registration & Hotel Accomodation
Online registration is now closed. Please register at the conference.Hotel accomodations can now be made. Reservation deadline to receive the EPEPS rate of $169 per night is October 15, 2013.
Author Presentation Information
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